Form Four graduates have another chance to apply for technical institute admissions for January intake as part of the government’s continual placement policy.
Through the Kenya Universities and Colleges Central Placement Service (KUCCPS), candidates can apply for artisan, craft and diploma courses up to October 16.
According to the placement agency, there are more than 300,000 chances to fill under the periodic registrations that accept Form Four graduates from the year 2000.
Applicants pay Sh1,500 to KUCCPS directly and another Sh1,500 on admission through the various institutes.
Technical institutes and polytechnics admit students throughout the year in September, January and May, a calendar that the placement agency has adopted to facilitate smooth transfers to higher learning institutions.
Some 129,536 Form Four graduates who sat for the 2021 Kenya Certificate of Secondary Education (KCSE) examination early this year were picked to join the TVETs in September.
Continual registration became necessary since a number of KCSE graduates do not apply for the thousands of study chances provided at various technical institutes and polytechnics.
This is the state of affairs despite the Sh30,000 yearly capitation per learner offered at the TVETs under the Ministry of Education.
While some 826,807 learners sat for KCSE early this year, 555,573 neither applied for TVET nor university courses. After the 2020 examination, 604,021 Form Four graduates never applied, revealing the limited information the youth and their families have about further education.
The central admissions through KUCCPS has reduced the burden of looking for an appropriate middle level college. Through KUCCPS, applicants get a chance to assess hundreds of courses and the various colleges that offer them across the country.
Technical institutes and polytechnics charge an annual fees of Sh56,420, excluding boarding charges. Learners placed to TVETs under the Ministry of Education benefit from a Sh30,000 capitation annually, reducing the fees to Sh26,420.
